產品描述
電子資訊工業近幾年來在中國的迅速發展下，結合各種相關產業，已經成為中國蓬勃發展、舉足輕重的新興產業。
江蘇諾德正是藉此信息產業化發展之平臺，以專業制造電子基礎材料為優勢，于2007年開始建立銅箔基板生產基地，憑借優秀的科技人才與創新的研發能力，配套發展生產通訊設備、數碼家電、電腦等產品之主要電子基礎材料：銅箔基板，提供給客戶滿意的產品選擇與售后服務。
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RL150 |
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(UL ANSI:FR-4.0)Mid-Tg Lead-Free /UV Blocking |
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特點
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應用領域 |
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FEATURES
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APPLICATIONS |
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GENERAL PROPERTIES |
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Test Item |
Test condition |
Units |
Standard value |
Typical value |
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1.Peel Strength , IBS/IN,Minimum,1 OZ |
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IBS/IN |
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As received |
A |
≥8.0 |
12.6 |
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After thermal stress |
A |
≥8.0 |
12.6 |
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2. Volume resistivity ,Minimum |
E-24/125 |
MΩ.cm |
≥103 |
≥106 |
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3. Surface resistivity , Minimum |
E-24/125 |
MΩ |
≥103 |
≥106 |
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4.Water absorption , Maximum |
E-1/105+des |
% |
≤0.50 |
0.13 |
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5.Dielectric Breakdown, Minimum |
D-48/50 D-0.5/23 |
Kv |
≥40 |
43 |
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6. Flexural strength ,Minimum |
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Mpa |
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Length direction |
A |
≥415 |
520 |
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Cross direction |
A |
≥345 |
450 |
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7.Arc resistance ,Minimum |
D-48/50 |
S |
≥60 |
140 |
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8.Flammability |
A |
S |
UL-94V0 |
UL-94V0 |
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9. Permittivity 1MHZ ,Maximum |
A |
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≤5.4 |
4.9 |
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10.Loss tangent 1MHZ ,Maximum |
A |
--- |
≤0.035 |
0.016 |
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11.Thermal stress 288℃,10sec( Minimum ) |
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Non etched specimen |
A |
NO DEFECT |
NO DEFECT |
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Etched |
A |
NO DEFECT |
NO DEFECT |
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12. TG(DSC,℃) |
A |
℃ |
≥150 |
152 |
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13. CTI，V |
TEC-112 |
V |
≥175 |
200 |
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Note: |
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Warpage of Warpage of
(No-treating) (After treating:125℃ 2hr)
Peel strength
※Specimen T hickness:1.6mm single side board
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PURCHASING INFORMATION |
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Thickness |
Copper foil |
Standard Size |
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0.2mm to 3.4mm |
12μm to 105μm |
1041×1245mm（41″×49″） 940×1245mm（37″×49″） |
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※ Other sheet size and thickness could be available upon request. |
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合作意向表
Cooperation Intent Form
